| 摘要: |
| 利用“铆钉法”制备了界面为曲面的Cu-Al扩散偶。用光学显微镜和彩色金相技术，研究了烧结过程中界面的 迁移情况及其影响因素。研究表明,界面迁移过程受原子的扩散控制；温度是影响界面迁移的主要因素，保温时间 是次要因素;试样烧结过程中Cu/Al界面双向迁移并且向A1侧迁移的程度较大。 |
| 关键词: Cu-Al扩散偶 扩散层 界面迁移 Kirkendall效应 |
| DOI： |
| 分类号: |
| 基金项目:国家自然科学基金资助项目(50371059) |
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| Study of Cu/Al interface during solid phase diffusion |
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GENG Xiang-ying, HE Yan-ling,LI Shi-chun
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(College of Mechanical and Electronic Engineering in China University of Petroleum, Cbngying 257061, Shandong Province，China)
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| Abstract: |
| Cu-Al diffusion couples with curving interfaces were prepared by mechanical method. With the help of optical mi-croscope(OM) and color metallograph, interface migration and its influencing factors were investigated during sintering. |
| Key words: Cu-Al diffusion couples diffusion layer interface migration Kirkendall effect |
